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Add thermal via support for DFN footprints - #810

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techmannih merged 1 commit into
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dfn1
Aug 19, 2026
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Add thermal via support for DFN footprints#810
techmannih merged 1 commit into
mainfrom
dfn1

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@techmannih

@techmannih techmannih commented Aug 19, 2026

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Screenshot 2026-08-19 at 08 14 55 Adds configurable thermal vias to DFN footprints using the existing shared thermal-via implementation.
  • Supports thermalvias, thermalviapitch, thermalviaid, and thermalviaod

  • Exposes the new options through the typed builder API

  • Adds geometry assertions and an SVG snapshot for a configurable 2×3 via grid

  • Retains existing validation for via dimensions and thermal-pad fit

@techmannih
techmannih requested a review from seveibar as a code owner August 19, 2026 02:42
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@techmannih
techmannih merged commit a6fa68e into main Aug 19, 2026
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