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ADX (Advanced Devices eXtended)

[ English | 日本語 (docs/ja/README.md) ]

ADX (Advanced Devices eXtended) is an open-source modular hardware standard and control platform engineered around the core principle of "Enclosure-Friendly" hardware design.

While traditional prototyping boards excel on the workbench, deploying them into real-world enclosures, harsh industrial cabinets, or outdoor environments introduces friction—screw holes colliding with traces, multi-directional wiring protrusions, and rigid pin headers that cannot absorb mechanical tolerances.

ADX solves this through the 8748 Form Factor (87.0 mm × 48.0 mm) and a flexible 20-pin IDC Eject Header bus. Built upon a single, indestructible, industrial-grade core (ADX CORE-A: $28) and an open, dongle-free field protocol (MR32), ADX provides an uncompromised bridge from desktop prototyping to professional social infrastructure.

1. Key Architectural Features

  • Enclosure-Friendly Mechanical Alignment (8748 Form Factor): 87.0 mm × 48.0 mm outline with standardized M3 mounting holes (77.0 mm × 38.0 mm pitch) featuring generous $5.0\text{ mm}$ edge margins to accommodate standard screw washers without damaging PCB copper.
  • Floating Safe-Zone Architecture (Zero Self-Heating): High-voltage DC-DC converters are decoupled from the core board and delegated to modular Power CARDs. The core board remains a pure, cool 5V floating zone, achieving full Industrial Grade (-40°C to +105°C) durability even in sealed IP67 waterproof boxes.
  • Galvanically Isolated Differential Bus (RS-485): Onboard Mornsun TDA51S485HC transceiver with integrated isolated power DC-DC (2500VDC isolation) directly coupled to a screwless, front-accessible spring clamp terminal block (DB142R-5.08).
  • PC-Protected Dual-Feed Power Topology: USB Type-C 6P input protected by an ultra-low-loss ideal diode (TI LM66100), ensuring zero back-feed into connected host PCs/laptops when external field power is active.
  • Latch-Locking 20-Pin Eject Header: Heavy-duty MIL-DTL-83503 compliant ejector header ensuring zero vibration disconnects and 100% reverse/misalignment prevention, providing bidirectional 5V/2A power delivery.
  • Ultra-Low Power BMC Supervisor: Secondary MCU (ATtiny412) operating in the nanoampere sleep tier, enabling touchless remote Over-The-Wire (OTW) firmware flashing via mobile PWA.
  • MR32 Protocol (Dongle-Free Architecture): Deterministic 32-byte fixed-length packet protocol enabling instant, 3-second OTW firmware flashing and inter-node networking using any generic $3–$5 USB-RS485 dongle directly from smartphone browsers (Android PWA) and PCs without proprietary hardware lock-in.

2. Hardware Lineup & Ecosystem

┌────────────────────────────────────────────────────────────────────────┐
│                   【 ADX CORE-A 】($28 / Universal Core)               │
│  - 5V-Dedicated / -40°C to +105°C Industrial Grade / Zero Heat         │
│  - Fully Isolated RS-485 (2500VDC) + Screwless Spring Terminal Block    │
│  - USB Type-C 6P (Ideal Diode Reverse-Current Protection)              │
│  - 20P Latch Eject Header (5V/2A Bidirectional Power Bus)              │
│  - Board Management Controller (BMC) for <10µA Sleep & Remote Flashing │
│  - Native MR32 Protocol Stack (Standard UART 8N1 + CRC-16)             │
└───────────────────────────────────┬────────────────────────────────────┘
                                    │
        ┌───────────────────────────┴───────────────────────────┐
        ▼ 20-Pin IDC Expansion Bus                              ▼ Front RS-485 Terminal
┌───────────────────────────────────┐               ┌───────────────────────────────────┐
│     【 CARD Series (Modular) 】   │               │ 【 Generic USB-RS485 Dongles 】   │
│                                   │               │ (Dongle-Free Architecture)        │
│ ① AAA 2S Power CARD (Battery)     │               │ - Off-the-shelf $3–$10 converters │
│    5V Boost / BMC-Gated Sleep     │               │   (CH340G, CP2102, FTDI, PL2303)  │
│ ② DC 12V–48V Power CARD (Telecom) │               │ - Direct Phone (Android PWA) & PC │
│    Isolated DCDC / -48V & 24V IN  │               │ - 100% Electrically Protected by  │
│ ③ Prototyping CARD                │               │   CORE-A Onboard 2500V Isolation  │
│    20P Pass-Through + Breadboard  │               │ - 3-second MR32 OTW Flashing      │
│ (Future: 24V I/O, Relay CARDs)    │               │                                   │
└───────────────────────────────────┘               └───────────────────────────────────┘

2.1 Core Board

  • ADX CORE-A ($28.00 USD): The absolute standard MCU board of the ADX ecosystem. Driven by a Microchip ATtiny1616-MNR and ATtiny412-SSNR, featuring fully isolated RS-485, AEC-Q102 automotive LEDs (-40°C to +110°C), and rugged front terminals.

2.2 Modular Expansion CARDs

  • AAA 2S Battery CARD: Ultra-low quiescent boost converter feeding 5V into the VDD bus, with BMC-linked complete shutdown.
  • DC 12V–48V Industrial Power CARD: Galvanically isolated wide-input DC-DC feeding clean 5V, supporting factory 24V and telecom -48V infrastructure.
  • Prototyping CARD: Universal breadboard area with 20-pin pass-through.

3. Core Specifications & Guidelines

3.1 8748 Form Factor

Mechanical dimensioning co-designed for seamless enclosure integration and 3D printing.

3.2 ADX Pinout (v2)

A unified 20-pin ribbon bus featuring 5V/2A power delivery, short-prevention isolation, EXTCLK shielding, and dynamic PORTMUX peripheral routing.

3.3 Hardware Design Guidelines (RFC 2119: MUST / SHOULD / MAY)

Standards governing official and third-party extension CARD design to guarantee zero-accident ecosystem compatibility.

  • 【MUST】Mandatory: Power CARDs must implement reverse-current blocking diodes on VDD output; Pin 5 N.C. isolation barrier must remain unconnected.
  • 【SHOULD】Recommended (Official Grade): Latch-locking Eject Header, galvanically isolated DCDCs for industrial voltages, 8748 dimensions, -40°C to +105°C temperature ratings.
  • 【MAY】Optional: Non-isolated buck converters for hobby use, custom board outlines, shroud box headers, unpopulated battery monitor lines.
  • Full Specification: 日本語 (docs/ja/adx_formfactor_guidelines.md)

4. Software & Cloud Ecosystem (PWA + Cloud API)

Eliminating the maintenance burden of native mobile apps (16KB page size crashes, OS scoped-storage limitations, app store gatekeepers):

┌────────────────────────────────────────────────────────┐
│  ① Cloud Compile API (arduino-cli / MegaCoreX)         │
│     - Receives code ➔ Compiles in 1 sec ➔ Returns .hex │
└───────────────────────────┬────────────────────────────┘
                            │ .hex (Compact Binary)
                            ▼
┌────────────────────────────────────────────────────────┐
│  ② Web PWA (Zero-Install, Runs in Any Browser)         │
│     - Real-time parameter tuning via EEPROM (<0.1s)    │
│     - WebSerial / WebUSB transfer (MR32 Protocol)      │
└───────────────────────────┬────────────────────────────┘
                            │ USB (Generic RS-485 Dongle)
                            ▼
┌────────────────────────────────────────────────────────┐
│  ③ Generic USB-RS485 Dongle ➔ ADX CORE-A               │
│     - 3-second deterministic OTW flashing via MR32     │
│     - 2,500V onboard galvanic isolation for safety     │
└────────────────────────────────────────────────────────┘

5. Documentation (多言語ドキュメント)

6. Repository Structure

ADX/
├── README.md               # Global portal & overview (this file)
├── LICENSE.md              # Multi-licensing policy & trademark notices
├── LICENSES/               # REUSE-compliant license texts (CC-BY-4.0, CERN-OHL-P-2.0, MIT)
├── Project_Snapshot.md     # Project status, history, and roadmap
├── docs/                   # Full multilingual documentation (CC BY 4.0)
│   ├── en/                 # English documentation
│   └── ja/                 # Japanese documentation
├── hardware/               # Hardware design & production files (CERN-OHL-P-v2)
│   ├── CORE-A/             # Flagship universal tough MCU board (-40°C~+105°C, isolated RS-485)
│   ├── CARD/               # Modular add-on boards (Power, Prototyping)
│   ├── Formfactor/         # Mechanical 8748 templates and CAD models
│   └── archive/            # Retired / archived hardware designs (RPR4, Core-S, Core-D, Core-O)
├── firmware/               # Drivers, BSP, bootloaders, and samples (MIT)
├── logo/                   # Brand assets & logos
└── memo/                   # Engineering notes & strategic concept reports

7. License

The ADX project is released under a tri-license architecture tailored for open collaboration:

Refer to LICENSE.md for full licensing terms and trademark policies.